1.667MHz fCK for 1333Mb/sec/pin
2. 8 independent internal bank
3. Programmable CAS Latency: 9, 8, 7, 6
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4. Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
5. Programmable CAS Write Latency(CWL) equal 7 (DDR3-1333)
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6. 8-bit pre-fetch
7. Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tCCD equal 4 which does not allow seamless read or write (either on the fly using A12 or MRS)
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8. Bi-directional Differential Data Strobe
9. Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm +/- 1%)
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10. On Die Termination using ODT pin
11. On-DIMM thermal sensor (Grade B)
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12. Asynchronous Reset
13. PCB : Height 0.740 (18.75mm), double sided component
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CL(IDD) : 9 cycles
Row Cycle Time (tRCmin) :49.5ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin):160ns (min.)
Row Active Time (tRASmin) :36ns (min.)
Power (Operating) : (1.35V) equal TBD (1.50V) equal TBD
UL Rating :94 V - 0
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Item Dimension (L"xW"xH"): 2.17 x 6.7 x 0.52
Weight: 0.15 lb
Warranty Information Lifetime
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